Thermal Simulation Semiconductor Devices & Systems

Initial freelance contract till 31st January 2024 + extensions after

Remote Working (onsite in Munich for ramp up)

Description of Services:

• Thermal Simulations
• Calculation of thermal parameters such as Zth_JA/JC
• Creation of thermal simulation (models) with the tools ANSYS Mechanical/Workbench, ANSYS Icepak (AEDT/Classic) and Simcenter Flotherm
• Creation of thermal compact models (RC Networks)

Deliverables and Results:

• Thermal simulation models in ANSYS Mechanical/Workbench, ICEPAK, Simcenter Flotherm, processable format
• Thermal compact models (RC network models), Foster, Cauer models
• Simulation reports detailing problem description, Input parameters, boundary conditions and results, in particular temperature distribution and Zth/ Rth curves/ values

Requirements:

• Profound knowledge with software tools ANSYS Mechanical/Workbench, ANSYS ICEPAK (AEDT/Classic), Simcenter Flotherm

Education:

• Master / diploma in mechanical, electrical engineering or related disciplines

Professional Background & Experience:

• 4+ years of professional experience in thermal FEM simulation of micro-electronics products and systems, ideally in semiconductor packages
• Proficient in generation of 3d models