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Thermal Simulation Semiconductor Devices (ANSYS ICEPAK)

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Thermal Simulation Semiconductor Devices (ANSYS ICEPAK)

  • Location:


  • Sector:

    ConSol UK Semiconductors & Embedded Systems

  • Job type:

    Temporary & Contract

  • Salary:

    €50 - €65 per hour

  • Contact:

    Jamie Jenkins

  • Contact email:

  • Job ref:


  • Published:

    3 months ago

  • Duration:

    6 months +

  • Expiry date:


  • Startdate:


Thermal Simulation Semiconductor Devices & Systems

Initial freelance contract till 31st January 2024 + extensions after

Remote Working (onsite in Munich for ramp up)

Description of Services:

  • Thermal Simulations
  • Calculation of thermal parameters such as Zth_JA/JC
  • Creation of thermal simulation (models) with the tools ANSYS Mechanical/Workbench, ANSYS Icepak (AEDT/Classic) and Simcenter Flotherm
  • Creation of thermal compact models (RC Networks)

Deliverables and Results:

  • Thermal simulation models in ANSYS Mechanical/Workbench, ICEPAK, Simcenter Flotherm, processable format
  • Thermal compact models (RC network models), Foster, Cauer models
  • Simulation reports detailing problem description, Input parameters, boundary conditions and results, in particular temperature distribution and Zth/ Rth curves/ values


  • Profound knowledge with software tools ANSYS Mechanical/Workbench, ANSYS ICEPAK (AEDT/Classic), Simcenter Flotherm


  • Master / diploma in mechanical, electrical engineering or related disciplines

Professional Background & Experience:

  • 4+ years of professional experience in thermal FEM simulation of micro-electronics products and systems, ideally in semiconductor packages
  • Proficient in generation of 3d models